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Constructing Mobile Technology with E-Beam

August 29, 2014 by · Leave a Comment 

Written by: Denton Vacuum, LLC

Mobile phone circuitry is complex, and new manufacturing techniques had to be devised in order to keep costs low.

Your mobile phone is an advanced device, thanks in no small part to the circuitry involved in its manufacture. This circuitry is made possible thanks to all new manufacturing processes that can actually change the property of a substance at a molecular level. Here is how manufacturers create the circuit boards at work on your favorite mobile devices.

Mobile Micro Chip Manufacturing

The microchips inside your mobile phones go through a manufacturing process that is similar to semiconductors. First, the board is marked with invisible lines that a machine will read. The machine interprets these lines like a map, and it uses ion-beam etching to lay the circuitry. The circuitry is made of melted down metals, mostly consisting of copper and aluminum, which are good for conductive applications.

Ion Beam Etching Explained

The etching process is a bit like squirting gel from a gel paint. It involves making an indentation, so there is pressure involved, but the substance that is applied has to be broken down. Most of these substances are bars of metal that are put through e-beam evaporation until they are either melted or broken down into particulate matter.

Other Manufacturing Methods

A magnetron sputtering system could also be used, but the process is a bit different. This process uses extreme pressure, caused by the use of magnets, in short pulses to distribute materials across the substrate. As a side note, hard drives are made using a similar manufacturing technique that infuses diamond dust onto the substrate.

Related Story: Semiconductor Metallization Disposition Processes

Related Story: Sputtering Vs. Electron Beam Evaporation

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